- VCP offers in-house Low-Pressure Molding (LPM) services to encapsulate delicate electronic assemblies and connectors.
- Our MoldMan 6200 Shuttle Station Machine provides us with the flexibility to run small to high volume production runs.
- Our LPM uses very low viscosity allowing the over moulding and encapsulation of even the most sensitive circuits.
- This system allows for sealing against dirt, dust, and moisture; and in many cases provides up to an IP-68 rating.